Advanced Material Development (AMD) recently announced it has signed a LOI with Honeywell International to develop materials-based solutions for non-destructive testing of moulded materials that may have been subjected to high impact damage. This work is expected to lead to an ongoing funded programme of work in this field.
AMD CEO John Lee says, “This is a fantastic development for the company and illustrates the high level of engagement we are receiving in the US from both Government and Commercial partners, who are keen to work with us to develop new solutions for key challenges. We are delighted to have developed this collaborative relationship and look forward to working with key Honeywell personnel.”
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