Carbonix Materials wins $300,000 to develop graphene thermal interface materials for semiconductors

Carbonix Materials, the U.S. subsidiary of Taiwan Carbon Materials Corporation (TCMC), has secured $300,000 in funding for research on graphene-based materials that draw heat away from semiconductor components. The University at Buffalo’s (UB) Business & Entrepreneur Partnerships office helped the company win the awards.

The funding consists of a $250,000 NY THRIVE Innovation Voucher, available through the NY SMART I-Corridor Tech Hub, and $50,000 from the Faculty-Industry Applied Research (FIAR) program. The one-year NY THRIVE project will support testing, scale-up and commercialization. UB graduate students will evaluate heat transfer and durability using university facilities, and an industry consultant will help Carbonix identify prospective U.S. customers. The FIAR project will focus on material performance and manufacturability.

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