nanoSkunkWorkX raises $2 million to bring graphene-copper films to AI chip packaging

nSWX’s lead product, nSD-I, is a thin-film interface designed to help copper interconnects carry more current and spread heat more effectively without replacing copper itself or requiring changes to existing manufacturing equipment and processes. The company says peer-reviewed testing found its graphene-copper films moved heat across their surface more than twice as effectively as a plain copper baseline, and that follow-up testing showed the performance advantage held up after the material was used in pre-qualification components.

Malaysian deep tech startup nanoSkunkWorkX (nSWX) has raised US$2 million in seed funding led by Singapore’s Tin Men Capital, its first investment in a Malaysian startup, to advance a graphene-copper thin-film technology aimed at improving heat and current management inside AI chip packaging.nSWX’s lead product, nSD-I, is a thin-film interface designed to help copper interconnects carry more current and spread heat more effectively without replacing copper itself or requiring changes to existing manufacturing equipment and processes. The company says peer-reviewed testing found its graphene-copper films moved heat across their surface more than twice as effectively as a plain copper baseline, and that follow-up testing showed the performance advantage held up after the material was used in pre-qualification components.

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