Multilayer graphene tape delivers efficient cooling and electrical insulation in compact devices

The continuous miniaturization of integrated devices, accompanied by exponentially increasing power densities, imposes stringent requirements on thermal interface materials (TIMs) that must efficiently dissipate heat while providing strong electrical insulation within submillimeter thickness constraints. Conventional polymer composites and ceramic-filled films struggle to meet these competing demands, typically exhibiting in-plane thermal conductivities below 70 W m⁻¹ K⁻¹ once their thickness exceeds 200 µm. To overcome this limitation, the MTCEIT integrates graphene paper – a stacked and compressed assembly of two-dimensional graphene sheets – as a high-efficiency lateral heat spreading layer.

Researchers from Shanghai Jiao Tong University and Shanghai Electric Power Generation Equipment have developed a multilayer graphene-based thermally conductive and electrically insulating tape (MTCEIT) that achieves a combination of lateral heat spreading capability and dielectric integrity for compact, high-power electronic systems. The continuous miniaturization of integrated devices, accompanied by exponentially increasing power densities, imposes stringent requirements on thermal interface materials (TIMs) that must efficiently dissipate heat while providing strong electrical insulation within submillimeter thickness constraints. Conventional polymer composites and ceramic-filled films struggle to meet these competing demands, typically exhibiting in-plane thermal conductivities below 70 W m⁻¹ K⁻¹ once their thickness exceeds 200 µm. To overcome this limitation, the MTCEIT integrates graphene paper – a stacked and compressed assembly of two-dimensional graphene sheets – as a high-efficiency lateral heat spreading layer.

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