Apacer’s copper-graphene layer cuts DDR5 memory temperatures by more than 20°C without fans

Taiwanese memory and storage maker Apacer has developed a thermal solution for industrial DDR5 memory modules built around a copper-graphene composite layer, which the company says lowers module temperatures by over 20°C in systems with no active cooling. The product, GraTherX, was introduced in June 2026 and is being shown at electronica 2026 in Munich, where Apacer describes it as the world’s first thermal-balanced DDR5 technology.

GraTherX is a two-sided structure that cools both faces of the memory module, adding roughly 0.17 mm per side, which Apacer presents as a drop-in addition requiring no redesign of existing DDR5 modules. Because the conductive layer sits close to the memory chips and their traces, the design also incorporates an insulating layer to reduce the risk of short circuits. It is offered for both ECC and non-ECC industrial modules.

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