The Horizon Europe project L2D2, funded by the European Innovation Council, has announced technical achievements that “could reshape the future of silicon photonics, semiconductor manufacturing, and high-speed data communications”. The project has developed a laser-based, single-step and solvent-free digital process for transferring graphene and other 2D materials onto CMOS-compatible and silicon photonics wafers up to 8 inches. This innovation, known as Laser Digital Transfer (LDT), addresses one of the most persistent bottlenecks in 2D materials integration: enabling selective, clean and defect-free, compatible with industrial upscaling.
L2D2 brings together leading research and industry partners – National Technical University of Athens (coordinator), Graphenea Semiconductor, NVIDIA Mellanox, Bar-Ilan University, and Exelixis Research Management & Communication – combining deep expertise in materials science, semiconductor engineering, and exploitation strategy.
The Horizon Europe project L2D2, funded by the European Innovation Council, has announced technical achievements that “could reshape the future of silicon photonics, semiconductor manufacturing, and high-speed data communications”. The project has developed a laser-based, single-step and solvent-free digital process for transferring graphene and other 2D materials onto CMOS-compatible and silicon photonics wafers up to 8 inches. This innovation, known as Laser Digital Transfer (LDT), addresses one of the most persistent bottlenecks in 2D materials integration: enabling selective, clean and defect-free, compatible with industrial upscaling.L2D2 brings together leading research and industry partners – National Technical University of Athens (coordinator), Graphenea Semiconductor, NVIDIA Mellanox, Bar-Ilan University, and Exelixis Research Management & Communication – combining deep expertise in materials science, semiconductor engineering, and exploitation strategy.
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