New process uses laser-induced graphene for hybrid circuit manufacturing

Researchers from Boise State University and Science Applications International Corporation have developed a new process utilizing copper-plated laser-induced graphene (LIG) to create direct-write, on-demand flexible electronics.

The process flow for creating Cu-LIG flexible hybrid electronics. Image credit: Advanced Materials Technologies

The novel approach to manufacturing flexible hybrid circuits could offer such benefits as reducing costs, waste, and environmental impact. Laser induced graphene uses a single-step laser manufacturing process that converts carbon-rich materials into a 3-dimensional conductive and porous structure with some regions of atomically thin graphene. This technique is scalable, cost-effective, and patternable, making it ideal for applications in electronics, sensing, and energy storage.

The process flow for creating Cu-LIG flexible hybrid electronics. Image credit: Advanced Materials TechnologiesThe novel approach to manufacturing flexible hybrid circuits could offer such benefits as reducing costs, waste, and environmental impact. Laser induced graphene uses a single-step laser manufacturing process that converts carbon-rich materials into a 3-dimensional conductive and porous structure with some regions of atomically thin graphene. This technique is scalable, cost-effective, and patternable, making it ideal for applications in electronics, sensing, and energy storage.

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