Researchers from North Carolina State University and Iowa State University have demonstrated a new technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors, and could pave the way for self-assembling more complex electronic devices without relying on existing computer chip manufacturing techniques.
D-Met fabricated patterns produce components for potential use in microelectromechanical systems (MEMS). Image credit: Julia Chang and NCSU.
“Existing chip manufacturing techniques involve many steps and rely on extremely complex technologies, making the process costly and time consuming,” says Martin Thuo, corresponding author of a paper on the work and a professor of materials science and engineering at North Carolina State University. “Our self-assembling approach is significantly faster and less expensive. We’ve also demonstrated that we can use the process to tune the bandgap for semiconductor materials and to make the materials responsive to light – meaning this technique can be used to create optoelectronic devices. What’s more, current manufacturing techniques have low yield, meaning they produce a relatively large number of faulty chips that can’t be used. Our approach is high yield – meaning you get more consistent production of arrays and less waste.”
Researchers from North Carolina State University and Iowa State University have demonstrated a new technique for self-assembling electronic devices. The proof-of-concept work was used to create diodes and transistors, and could pave the way for self-assembling more complex electronic devices without relying on existing computer chip manufacturing techniques.
D-Met fabricated patterns produce components for potential use in microelectromechanical systems (MEMS). Image credit: Julia Chang and NCSU.
“Existing chip manufacturing techniques involve many steps and rely on extremely complex technologies, making the process costly and time consuming,” says Martin Thuo, corresponding author of a paper on the work and a professor of materials science and engineering at North Carolina State University. “Our self-assembling approach is significantly faster and less expensive. We’ve also demonstrated that we can use the process to tune the bandgap for semiconductor materials and to make the materials responsive to light – meaning this technique can be used to create optoelectronic devices. What’s more, current manufacturing techniques have low yield, meaning they produce a relatively large number of faulty chips that can’t be used. Our approach is high yield – meaning you get more consistent production of arrays and less waste.”
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